Chip-on-Board or "COB" refers to the mounting of a bare LED chip in direct contact with a substrate to produce LED arrays. COB LEDs have a number of advantages over older LED technologies, such as Surface Mounted Device ("SMD") LEDs or Dual In-line Package ("DIP") LEDs. Most notably, COB technology allows for a much higher packing density of the LED array, or what light engineers refer to as improved "lumen density"

Specifications

• Material: Made of Aluminum and Silica gel. Ultra-light, not easy to deform and great durability.
• Chip Material: AlGaInP
• Color Temperature: Cool white(6500K)
• Max Current: 400mA (1W)
• Power: 1W max
• Input Voltage: DC 3V
• Luminous Flux(lm): 100 lm
• Dimensions: 60x8 mm